Title:
RESIN-SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003158224
Kind Code:
A
Abstract:
To reduce the stress applied to a semiconductor element from filler contained in a sealing resin while disconnection of wires is prevented.
In a resin-sealed semiconductor device, a lead frame 2, an IC chip 3 fixed on the frame 2, and wires 6 connecting the chip 3 to the frame 2 are sealed with a resin. At the time of manufacturing the semiconductor device, a stress relieving layer 7 is formed in an area excluding bonding pads 5 on the surface of the IC chip 3 while the wires 6 are exposed.
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Inventors:
SEYA OSAMU
Application Number:
JP2001357451A
Publication Date:
May 30, 2003
Filing Date:
November 22, 2001
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/29; H01L21/56; H01L23/31; (IPC1-7): H01L23/29; H01L21/56; H01L23/31
Attorney, Agent or Firm:
Yoji Ito (2 outside)
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