Title:
CHIP HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/093211
Kind Code:
A1
Abstract:
The present application relates to a chip heat dissipation structure and an electronic device. The chip heat dissipation structure comprises a circuit board, a heat dissipation member, a heat conduction assembly, and a chip. The circuit board comprises a mainboard, a first bonding pad and a second bonding pad; the first bonding pad and the second bonding pad are respectively located on the surfaces of the two opposite sides of the mainboard, and the mainboard is provided with heat via holes communicated with the first bonding pad and the second bonding pad. The heat conduction assembly comprises a heat conduction sheet and an interface layer which are stacked, and the surface of the heat conduction sheet deviating from the interface layer is connected to the second bonding pad. The heat dissipation member comprises a heat dissipation plate, the heat dissipation plate and the mainboard are arranged in parallel at an interval, and the heat dissipation plate is attached to the surface of the interface layer deviating from the heat conduction sheet. The chip is fixed on the first bonding pad, and is used for transferring heat generated by the chip to the heat dissipation plate through the first bonding pad, the heat via holes, the second bonding pad, the heat conduction sheet and the interface layer in sequence. By means of the mode, direct contact between the chip and the heat dissipation plate can be avoided, and shielding processing can be conveniently performed on the chip.
Inventors:
HU YUANLIN (CN)
Application Number:
PCT/CN2022/117640
Publication Date:
June 01, 2023
Filing Date:
September 07, 2022
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K7/20; H01L23/34
Foreign References:
| CN217116715U | 2022-08-02 | |||
| CN205640794U | 2016-10-12 | |||
| CN105828571A | 2016-08-03 | |||
| CN103413802A | 2013-11-27 | |||
| US5581443A | 1996-12-03 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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