Title:
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/035101
Kind Code:
A1
Abstract:
Provided in embodiments of the present application are a chip packaging structure and a preparation method. The chip packaging structure comprises a first chip and a carrier board. The first chip is fixed on a first surface of the carrier board by means of a material. The carrier board comprises a groove structure, a groove bottom of the groove structure being buried in the carrier board, a groove opening of the groove structure being exposed at the first surface of the carrier board, and the groove structure at least partially surrounding a region of the first surface of the carrier board used for affixing the first chip. A side edge of the first chip extends to the groove opening of the groove structure, and an orthographic projection of the side edge of the first chip towards the carrier board is at least partially located within the groove structure. The present chip packaging structure can increase the reliability of a packaged chip.
Inventors:
PAN WEIJIAN (CN)
ZHAO HANG (CN)
ZHAO HANG (CN)
Application Number:
PCT/CN2021/116878
Publication Date:
March 16, 2023
Filing Date:
September 07, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/12; H01L23/13; H01L23/16; H01L23/28; H01L23/495; H01L23/498
Foreign References:
| CN213340339U | 2021-06-01 | |||
| CN104781930A | 2015-07-15 | |||
| US20050218482A1 | 2005-10-06 | |||
| JP2008011309A | 2008-01-17 | |||
| CN104779224A | 2015-07-15 | |||
| CN1501490A | 2004-06-02 | |||
| JP2008243879A | 2008-10-09 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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