Title:
CHIP SCALE PACKAGE STRUCTURE FOR MOISTURE-SENSITIVE HIGH-GAMUT BACKLIGHT APPLICATIONS, AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/056935
Kind Code:
A1
Abstract:
Disclosed are a chip scale package (CSP) structure for moisture-sensitive high-gamut backlight applications, having a double-layered package structure: the inner layer is a fluorescent glue film containing KSF fluorescent powder, and the outer layer is a transparent glue film containing an inorganic filler. Firstly, an LED chip array is inversely mounted on a substrate; secondly, the fluorescent glue film containing the KSF fluorescent powder is attached to the chips in a five-sided vacuum conformal manner; then the glue film at the bottom is cut along an external elevation of a package body, then the cut package body is subjected to secondary array on the substrate, and an outer surface of the cut package body packages the transparent silicone glue film containing the micron-sized inorganic filler by vacuum pressing; finally, the CSP package body is cut after curing. The present invention has excellent moisture resistance, high hardness, heat conduction, and light decay resistance, and can be used for a high-power LED device to improve the overall performance of the finished CSP package body.
Inventors:
HAN YING (CN)
TAN XIAOHUA (CN)
LIU DONGSHUN (CN)
TAN XIAOHUA (CN)
LIU DONGSHUN (CN)
Application Number:
PCT/CN2020/072360
Publication Date:
April 01, 2021
Filing Date:
January 16, 2020
Export Citation:
Assignee:
TECORE SYNCHEM INC (CN)
International Classes:
H01L33/54
Foreign References:
| CN105938869A | 2016-09-14 | |||
| CN102336890A | 2012-02-01 | |||
| CN106972092A | 2017-07-21 |
Attorney, Agent or Firm:
SHANGHAI WEICE INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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