Title:
CHIP STRUCTURE, PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/151676
Kind Code:
A1
Abstract:
The present application relates to a chip structure, a packaging structure and a fabrication method therefor. The chip structure comprises: a substrate, an upper surface of the substrate being provided with a plurality of pads, at least two of the pads having the same properties; and a conductive interconnecting layer, which comprises a plurality of conductive interconnecting structures, the conductive interconnecting structures electrically connecting the pads having the same properties and being used to electrically connect to pins on a packaging base plate.
Inventors:
FAN ZENGYAN (CN)
Application Number:
PCT/CN2021/104952
Publication Date:
July 21, 2022
Filing Date:
July 07, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/488; H01L21/48; H01L21/50; H01L21/60
Foreign References:
| CN112864121A | 2021-05-28 | |||
| CN204991758U | 2016-01-20 | |||
| JPH0567650A | 1993-03-19 | |||
| CN201655790U | 2010-11-24 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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