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Title:
CHIP-TYPE CERAMIC SEMICONDUCTOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/059390
Kind Code:
A1
Abstract:
Provided is a chip-type ceramic semiconductor electronic component 10 in which the interface B between a first external electrode 3 and a second external electrode 4 does not easily peel, even when the dimensions are small. This chip-type ceramic semiconductor electronic component 10 comprises a ceramic element 2 that includes a ceramic semiconductor and that has first surfaces 21 and second surfaces 22 in contact with the first surfaces 21, first external electrodes 3 provided on the first surfaces 21 of the ceramic element 2, and second external electrodes 4 that cover the first external electrodes 3 and that extend to the second surfaces 22 of the ceramic element 2, the area of a first surface 35 of the first external electrodes 3 being less than 0.17 mm2, and hard particles 7 made of a material harder than the first external electrodes 3 being positioned at the interfaces B between the first external electrodes 3 and the second external electrodes 4.

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Inventors:
ISOGAI KEISUKE (JP)
SAKI YOSHINOBU (JP)
Application Number:
PCT/JP2021/029611
Publication Date:
March 24, 2022
Filing Date:
August 11, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/02; H01C7/04; H01G4/30
Foreign References:
JP2009049320A2009-03-05
JP2008028064A2008-02-07
JP2005327929A2005-11-24
JP2009200421A2009-09-03
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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