Title:
CIRCUIT ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO/2021/100544
Kind Code:
A1
Abstract:
Provided is a circuit arrangement having a novel structure with which it is possible to control the repulsive force of a heat-conducting member and thereby preventing the occurrence of a problem due to an excessive repulsive force of the heat-conducting member. A circuit arrangement 10 is provided with: a heat-generating component 12; bus bars 14a, 14b connected to connecting portions 22a, 22b of the heat-generating component 12; an insulating base member 18 on which the heat-generating component 12 and the bus bars 14a, 14b are held; and an elastic heat-conducting member 16 thermally connected with the bus bars 14a, 14b. The bus bars 14a, 14b press onto the heat-conducting member 16 in a mounting direction of the bus bars 14a, 14b with respect to the base member 18, and the bus bars 14a, 14b abut against bus bar positioning portions 54, 60 provided on the base member 18, whereby the positions of the bus bars 14a, 14b in the mounting direction are defined.
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Inventors:
KUZUHARA FUMIHIRO (JP)
Application Number:
PCT/JP2020/041865
Publication Date:
May 27, 2021
Filing Date:
November 10, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; H02G3/16; H05K7/06
Foreign References:
| JP2014103168A | 2014-06-05 | |||
| JP2020184564A | 2020-11-12 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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