Title:
CIRCUIT BOARD INCLUDING INSULATING LAYER HAVING A PLURALITY OF DIELECTRICS WITH DIFFERENT DIELECTRIC LOSS, AND ELECTRONIC DEVICE INCLUDING THE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/009361
Kind Code:
A1
Abstract:
An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.
Inventors:
PARK SUNGWON (KR)
SON DONGIL (KR)
HA SANGWON (KR)
SON DONGIL (KR)
HA SANGWON (KR)
Application Number:
PCT/KR2019/007659
Publication Date:
January 09, 2020
Filing Date:
June 25, 2019
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H01Q9/04; H01Q1/24; H04M1/02; H05K1/02
Foreign References:
| US20090315797A1 | 2009-12-24 | |||
| JP2007096159A | 2007-04-12 | |||
| US20120205141A1 | 2012-08-16 | |||
| US20030189246A1 | 2003-10-09 | |||
| KR20170100752A | 2017-09-05 |
Other References:
See also references of EP 3766129A4
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
Download PDF: