Title:
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/098531
Kind Code:
A1
Abstract:
The present application provides a circuit board and a manufacturing method therefor. The circuit board comprises: a core board, at least one chip, a first circuit layer, and a first insulating layer. A groove body is formed on the core board. The chip is provided in the groove body. The chip is provided with a first lead-out terminal. The first circuit layer is provided on at least one side of the core board. The first insulating layer is provided between the core board and the first circuit layer. The first lead-out terminal passes through the first insulating layer and is connected to the first circuit layer, so that the chip is electrically connected to the first circuit layer. Thus, the wiring between the chip and the circuit is more flexible.
Inventors:
HUANG LIXIANG (CN)
WANG ZEDONG (CN)
MIAO HUA (CN)
WANG ZEDONG (CN)
MIAO HUA (CN)
Application Number:
PCT/CN2020/127022
Publication Date:
May 27, 2021
Filing Date:
November 06, 2020
Export Citation:
Assignee:
SHENNAN CIRCUITS CO LTD (CN)
International Classes:
H05K3/46; H05K1/18
Foreign References:
| CN112203411A | 2021-01-08 | |||
| CN109755189A | 2019-05-14 | |||
| US20140182897A1 | 2014-07-03 | |||
| US20150107880A1 | 2015-04-23 | |||
| US20160338195A1 | 2016-11-17 | |||
| US20160105957A1 | 2016-04-14 | |||
| US20160105966A1 | 2016-04-14 | |||
| US20190200462A1 | 2019-06-27 | |||
| CN103703874A | 2014-04-02 | |||
| US20160143134A1 | 2016-05-19 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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