Title:
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/212479
Kind Code:
A1
Abstract:
A circuit board, comprising an electromagnetic shielding film, an insulating adhesive portion, a first signal line and a second signal line; the electromagnetic shielding film comprises a first surface and a second surface opposite to each other, the electromagnetic shielding film is divided into a body portion, a first bending portion, and a second bending portion, the first signal line and the second signal line are spaced apart on the first surface in a first direction, the first bending portion and the second bending portion are connected to two opposite sides of the body portion respectively in the first direction, the first bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the first signal line, the second bending portion is bent such that the second surface faces outwards and matches with the body portion to surround the second signal line, the first bending portion and the second bending portion separate the first signal line and the second signal line from each other, and the insulating adhesive portion fills a gap between the first bending portion and the body portion and a gap between the second bending portion and the body portion. The present application further provides a method for manufacturing a circuit board.
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Inventors:
LI YANG (CN)
LI YANLU (CN)
LIU LIKUN (CN)
LI YANLU (CN)
LIU LIKUN (CN)
Application Number:
PCT/CN2020/086739
Publication Date:
October 28, 2021
Filing Date:
April 24, 2020
Export Citation:
Assignee:
HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
International Classes:
H05K9/00
Foreign References:
| CN1744795A | 2006-03-08 | |||
| US9769967B2 | 2017-09-19 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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