Title:
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/212480
Kind Code:
A1
Abstract:
Disclosed is a rigid-flexible printed circuit board (100), comprising a circuit substrate (10), an adhesive layer (35) and two outer conductive circuit layers (330). At least one opening (101) penetrating the circuit substrate (10) is provided in the circuit substrate (10); the two outer conductive circuit layers (330) are respectively stacked on two opposite sides of the circuit substrate (10) in the penetrating direction of the opening (101); the adhesive layer (35) is bonded between the circuit substrate (10) and each of the outer conductive circuit layers (330) and fills the opening (101). The rigid-flexible printed circuit board (100) is convenient to manufacture. Further disclosed is a manufacturing method for the rigid-flexible printed circuit board (100).
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Inventors:
LI WEIXIANG (CN)
Application Number:
PCT/CN2020/086740
Publication Date:
October 28, 2021
Filing Date:
April 24, 2020
Export Citation:
Assignee:
QING DING PREC ELECTRONICS HUAIAN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
International Classes:
H05K1/14
Foreign References:
| CN101990355A | 2011-03-23 | |||
| CN105657971A | 2016-06-08 | |||
| CN203482483U | 2014-03-12 | |||
| CN108076589A | 2018-05-25 | |||
| CN110278657A | 2019-09-24 | |||
| US20120314390A1 | 2012-12-13 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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