Title:
CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/190575
Kind Code:
A1
Abstract:
A circuit board 1 according to the present invention comprises: a first ceramic-resin composite material layer 10 containing a first ceramic and a first resin; metal patterns 20 provided on the first ceramic-resin composite material layer 10; and a second ceramic-resin composite material layer 30 provided on the first ceramic-resin composite material layer 10 and containing a second ceramic and a second resin, said second ceramic-resin composite material layer 30 covering at least the first-ceramic-resin-composite-material-layer-side edges 211 of the side surfaces 21 of the metal patterns 20. A circuit board manufacturing method according to the present invention comprises: a metal pattern forming step for forming metal patterns on a first semi-cured composite sheet containing a first ceramic and a semi-cured first resin composition; and a pressure applying step for applying pressure to at least some of the metal patterns. The present invention makes it possible to provide a circuit board that is not susceptible to cracks even when exposed to high and low temperature thermal cycles, and a method for manufacturing the circuit board.
Inventors:
MIYATA KENJI (JP)
IWAKIRI SHOHJI (JP)
INOUE SAORI (JP)
KUMAGAI RYOTA (JP)
IWAKIRI SHOHJI (JP)
INOUE SAORI (JP)
KUMAGAI RYOTA (JP)
Application Number:
PCT/JP2023/012636
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/13; H01L23/12; H05K1/05; H05K3/20; H05K3/44
Domestic Patent References:
| WO2021200965A1 | 2021-10-07 |
Foreign References:
| JP2021132216A | 2021-09-09 | |||
| JP2001203313A | 2001-07-27 | |||
| JP2017085077A | 2017-05-18 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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