Title:
HEAT PUMP DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190574
Kind Code:
A1
Abstract:
This heat pump device comprises: a heat source machine that generates hot water using a heat source; a radiant terminal; a forced convection terminal; and a control device. The radiant terminal is connected to the heat source machine, and adjusts the temperature of the indoor space with radiant heat obtained by flowing hot water from the heat source machine into a radiant panel. The forced convection terminal is connected to the heat source machine, flows the hot water from the heat source machine into a user-side heat exchanger, and adjust the temperature of the indoor space by blowing out air that has been heat-exchanged with the hot water in the user-side heat exchanger by means of a blower fan. The control device controls the heat source machine, the radiant terminal, and the forced convection terminal. The control device includes a control unit that controls the forced convection terminal to reduce the airflow of the forced convection terminal compared to the airflow when only the forced convection terminal is operated, when the radiant terminal and the forced convection terminal are operated at the same time. Provided is a heat pump device capable of suppressing a deterioration in user comfort.
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Inventors:
SHIMANO DAIKI (JP)
KONDO MASAHIRO (JP)
SUDA KAZUKI (JP)
KONDO MASAHIRO (JP)
SUDA KAZUKI (JP)
Application Number:
PCT/JP2023/012634
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
FUJITSU GENERAL LTD (JP)
International Classes:
F24F5/00; F24D3/00; F24F11/64; F24F11/74; F24F11/83; F24F140/20
Foreign References:
| JPH09287748A | 1997-11-04 | |||
| JPS57137943U | 1982-08-28 | |||
| JP2003322348A | 2003-11-14 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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