Title:
CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/056663
Kind Code:
A1
Abstract:
Disclosed is a circuit board which comprises: a contact hole that is formed in a first insulating layer, a first conductive film and a second insulating layer; and a second conductive film that is connected to the first conductive film within the contact hole. The contact hole is formed such that the inner diameter of the portion thereof formed in the second insulating layer is larger than the inner diameters of the portions thereof respectively formed in the first conductive film and the first insulating layer. The second conductive film is in contact with and connected to a surface of the first conductive film within the contact hole, said surface being on the reverse side of the insulating substrate-side surface of the first conductive film, and the inner wall surface of the first conductive film, said inner wall surface forming the contact hole.
Inventors:
FURUKAWA HIROAKI
Application Number:
PCT/JP2011/005909
Publication Date:
May 03, 2012
Filing Date:
October 21, 2011
Export Citation:
Assignee:
SHARP KK (JP)
FURUKAWA HIROAKI
FURUKAWA HIROAKI
International Classes:
H01L21/768; H01L21/28; H01L21/336; H01L23/522; H01L29/786; H05K1/11
Foreign References:
| JP2007013091A | 2007-01-18 | |||
| JP2007188936A | 2007-07-26 | |||
| JPH043455A | 1992-01-08 | |||
| JPS61129852A | 1986-06-17 | |||
| JPH06326050A | 1994-11-25 | |||
| JPH01268151A | 1989-10-25 |
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
Hiroshi Maeda (JP)
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Claims: