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Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/055049
Kind Code:
A1
Abstract:
A circuit board, according to an embodiment, comprises: an insulating layer; a circuit pattern layer disposed on the insulating layer; and a protective layer disposed on the insulating layer and the circuit pattern layer and including a plurality of openings. The openings include a plurality of first openings and a plurality of second openings, wherein the first openings vertically overlap an upper surface of a pad of the circuit pattern layer and do not horizontally overlap a side surface of the pad, and the second openings vertically overlap an upper surface of the pad of the circuit pattern layer and horizontally overlap at least a portion of the side surface of the pad.

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Inventors:
LEE KEE HAN (KR)
KIM SANG IL (KR)
NA SE WOONG (KR)
Application Number:
PCT/KR2022/014513
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/28; H01L23/28; H01L23/48; H05K1/11; H05K3/34
Foreign References:
KR20150058019A2015-05-28
KR100626617B12006-09-25
JP2012256956A2012-12-27
JP2017191892A2017-10-19
US20160081190A12016-03-17
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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