Title:
ELECTROMAGNETIC WAVE SHIELDING COVERLAY FILM, METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2010238870
Kind Code:
A
Abstract:
To provide an electromagnetic wave shielding coverlay film formed by integrating an electromagnetic shielding adhesive sheet with a coverlay film, and to provide a manufacturing method capable of manufacturing a flexible printed wiring board filmy and excellent in flexibility inexpensively.
An insulating resin layer (A) formed from a polyurethane polyimide resin composition or a polyurethane polyurea resin composition, a conductive layer (B) and an insulating adhesive layer (C), are laminated one by one to form this electromagnetic wave shielding coverlay film, and a method of manufacturing the flexible printed wiring board is provided.
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Inventors:
KOBAYASHI HIDENORI
MATSUZAWA TAKAHIRO
NISHIYAMA YUJI
KUWABARA AKIFUMI
MATSUZAWA TAKAHIRO
NISHIYAMA YUJI
KUWABARA AKIFUMI
Application Number:
JP2009084509A
Publication Date:
October 21, 2010
Filing Date:
March 31, 2009
Export Citation:
Assignee:
TOYO INK MFG CO
International Classes:
H05K3/28; H05K9/00
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