Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/018234
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: a first insulating layer; a first circuit pattern layer arranged on the first insulating layer; and a second insulating layer arranged on the first insulating layer and the first circuit pattern layer, wherein the second insulating layer includes a first region including a cavity and a second region excluding the first region, and the first region of the second insulating layer includes a first portion that is concave toward a lower surface of the second insulating layer and a second portion that is convex toward an upper surface of the second insulating layer.

More Like This:
WO/2012/078377BUMPLESS BUILD-UP LAYER AND LAMINATED CORE HYBRID STRUCTURES AND METHODS OF ASSEMBLING SAME
JP3424344SEMICONDUCTOR DEVICE
Inventors:
JEONG JAE HUN (KR)
SHIN JONG BAE (KR)
LEE SOO MIN (KR)
Application Number:
PCT/KR2022/011955
Publication Date:
February 16, 2023
Filing Date:
August 10, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/18; H01L23/538; H05K1/09; H05K1/11
Foreign References:
KR20210000105A2021-01-04
KR20040047759A2004-06-05
KR20210046978A2021-04-29
JP2000244127A2000-09-08
CN102573280B2014-11-12
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: OPTICAL SYSTEM AND CAMERA MODULE COMPRISING SAME

Next Patent: CIRCUIT BOARD