Title:
CIRCUIT MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/123381
Kind Code:
A1
Abstract:
A circuit module (301), provided with: a first substrate (201) having a first main surface (201a); a first module (101) mounted on the first main surface (201a); a sealing resin part (3) formed on the first main surface (201a), the sealing resin part (3) covering the first module (101); and a conductor film (7) covering the side surface of the sealing resin part (3). The first module (101) includes a conductor part and an element placed on the conductor part, the element being capable of generating heat. The conductor part is connected to the conductor film (7) on the side surface of the sealing resin part (3).
Inventors:
FUJIKAWA KATSUHIKO (JP)
FUNAKAWA SHINGO (JP)
SATO KAZUSHIGE (JP)
AMACHI NOBUMITSU (JP)
FUNAKAWA SHINGO (JP)
SATO KAZUSHIGE (JP)
AMACHI NOBUMITSU (JP)
Application Number:
PCT/JP2017/042211
Publication Date:
July 05, 2018
Filing Date:
November 24, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L23/00; H01L23/28
Foreign References:
| JP2011211023A | 2011-10-20 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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