Title:
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/123380
Kind Code:
A1
Abstract:
[Problem] To provide a heat dissipation component which is for a semiconductor element, which has a high thermal conductivity and a linear expansion coefficient close to that of a semiconductor element, and which is highly reliable and highly resistant to corrosion. [Solution] The present invention has a tabular aluminum-diamond-based composite body 1 that contains a prescribed amount of a diamond powder in which the ratio of the area of a volume distribution of particles having a diameter of 1-35 μm to the area of a volume distribution of particles having a diameter of 45-205 μm ranges from 1:9 to 4:6, and in which a first peak and a second peak of the volume distribution of the particle diameter appears at 5-25 μm and at 55-195 μm, respectively, and the remaining portion being an aluminum-containing metal, wherein both principal surfaces of the composite body 1 are coated with a surface layer 4 that has a prescribed film thickness and that contains at least 80 vol% of the aluminum-containing metal, and at least two Ni-containing layers 5 are formed on the surface layer 4, the first and second layers from the surface layer 4 side are each an amorphous Ni-alloy layer having a prescribed thickness, and an Au layer 6 having a prescribed thickness is formed in the outermost layer. The amorphous Ni-alloy layer which is the first layer has a peel strength of 50 N/cm or more.
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Inventors:
ISHIHARA YOSUKE (JP)
MIYAKAWA TAKESHI (JP)
OTA HIROAKI (JP)
TSUKAMOTO HIDEO (JP)
MIYAKAWA TAKESHI (JP)
OTA HIROAKI (JP)
TSUKAMOTO HIDEO (JP)
Application Number:
PCT/JP2017/042209
Publication Date:
July 05, 2018
Filing Date:
November 24, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/373; B22D19/00; C22C1/05; C22C1/10; C22C19/03; C22C26/00; C22C29/18; C22C45/04; C23C18/16; C23C18/32; C25D7/12; H05K7/20
Domestic Patent References:
| WO2016002925A1 | 2016-01-07 | |||
| WO2013015158A1 | 2013-01-31 | |||
| WO2010007922A1 | 2010-01-21 |
Foreign References:
| JP2010176863A | 2010-08-12 | |||
| JPH04294009A | 1992-10-19 | |||
| JPH01132072A | 1989-05-24 | |||
| JPH09157773A | 1997-06-17 | |||
| JP2000303126A | 2000-10-31 | |||
| JP2014107468A | 2014-06-09 |
Other References:
See also references of EP 3564993A4
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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