Title:
CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/230125
Kind Code:
A1
Abstract:
Provided is a circuit structure comprising a heat-generating component which generates heat when electrically energized and which also includes a terminal 15, a metal busbar 20 which is connected to the terminal 15 and which includes an insulating resin layer 26 on the surface thereof, a heat transfer member 49 which contacts the portion of the busbar 20 where the resin layer 26 is formed and which absorbs heat transferred from the busbar 20 through the resin layer 26, and a case 40 having a metal portion that contacts the heat transfer member 49 and absorbs heat transferred from the heat transfer member 49.
Inventors:
IGURA KOUSHI (JP)
SHIMODA HIROKI (JP)
YANAGIDA TAIJI (JP)
SHIMODA HIROKI (JP)
YANAGIDA TAIJI (JP)
Application Number:
PCT/JP2021/017349
Publication Date:
November 18, 2021
Filing Date:
May 06, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B60R16/02; H02G3/16; H05K7/04; H05K7/06; H05K7/20
Domestic Patent References:
| WO2018105610A1 | 2018-06-14 |
Foreign References:
| JP2019169602A | 2019-10-03 | |||
| JP2006031959A | 2006-02-02 | |||
| JP2006187122A | 2006-07-13 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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