Title:
CIRCUIT SUBSTRATE AND MODULE
Document Type and Number:
WIPO Patent Application WO/2022/065373
Kind Code:
A1
Abstract:
A circuit substrate 1 characterized by comprising a substrate 10, an electrode pad 20 formed on the surface of the substrate 10, and a projecting electrode 25 formed on the electrode pad 20, and moreover characterized in that the top-surface-view shape of the electrode pad 20 on which the projecting electrode 25 is formed is larger than that of the projecting electrode 25, and a coating layer 40 is provided to at least part of the outer periphery of the electrode pad 20 on which the projecting electrode 25 is formed.
Inventors:
SUZUKI HISASHI (JP)
Application Number:
PCT/JP2021/034828
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28
Domestic Patent References:
| WO2008004423A1 | 2008-01-10 | |||
| WO2007049458A1 | 2007-05-03 |
Foreign References:
| JP2004014616A | 2004-01-15 | |||
| JP2017152678A | 2017-08-31 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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