Title:
CLEANING AGENT, CLEANING AGENT PRODUCTION METHOD, AND TARGET OBJECT PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/220711
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a cleaning agent capable of adequately eliminating residue in semiconductor production processes such as in the elimination of a temporary fixing material residue. The cleaning agent contains 3 to 10% by mass of tetramethylammonium hydroxide (A), 20 to 60% by mass of water (B), dimethylsulfoxide (C), and a compound (D) represented by formula (1). (In formula (1), R1 represents an alkanediyl group having 1 to 3 carbons; n represents an integer from 1 to 3; when n is 2 or greater, the plurality of R1 may be identical or different from one another; and R2 represents an alkyl group having 1 to 6 carbons.)
Inventors:
OISHI YOHEI (JP)
Application Number:
PCT/JP2019/004969
Publication Date:
November 21, 2019
Filing Date:
February 13, 2019
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C11D1/62; B08B3/08; C11D1/72; C11D7/50; H01L21/304
Domestic Patent References:
| WO2017056662A1 | 2017-04-06 |
Foreign References:
| JP2007254555A | 2007-10-04 | |||
| JP2011164293A | 2011-08-25 | |||
| JP2000089480A | 2000-03-31 | |||
| JP2016500918A | 2016-01-14 | |||
| CN105368611A | 2016-03-02 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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