Title:
CLOSING METHOD, STRUCTURE, RESIN
Document Type and Number:
WIPO Patent Application WO/2021/060376
Kind Code:
A1
Abstract:
Provided is a closing method for closing a hollow space developed in a structure with a resin, the method not requiring much effort and making it possible to obtain a smooth surface of the resin used to close the hollow space. The closing method according to the present invention includes: a closing step in which a hot-melt resin 4 having a solid matter content of at least 90% when the resin is uncured is attached to a structure 1 so that a hollow space 3 in a structure 1 is closed with the hot-melt resin 4; and a flattening step in which the hot-melt resin 4 that has been attached to the structure 1 is pressurized and heated so that the hot-melt resin 4 is flattened.
Inventors:
HATTORI AYAKO (JP)
TAKANOHASHI YOUHEI (JP)
FUTAMURA TAKAHIRO (JP)
TAKANOHASHI YOUHEI (JP)
FUTAMURA TAKAHIRO (JP)
Application Number:
PCT/JP2020/036033
Publication Date:
April 01, 2021
Filing Date:
September 24, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
E04F13/07; E04F13/08
Foreign References:
| JP2009257084A | 2009-11-05 | |||
| JP2016075087A | 2016-05-12 | |||
| JP2005325532A | 2005-11-24 | |||
| JP2005220717A | 2005-08-18 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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