Title:
COATED METAL ALLOY SUBSTRATE AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/114015
Kind Code:
A1
Abstract:
A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).
Inventors:
WU KT (CN)
CHANG JAMES (CN)
GUO ERIC (CN)
CHANG JAMES (CN)
GUO ERIC (CN)
Application Number:
PCT/CN2019/123982
Publication Date:
June 17, 2021
Filing Date:
December 09, 2019
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO (US)
WU KT (CN)
CHANG JAMES (CN)
GUO ERIC (CN)
WU KT (CN)
CHANG JAMES (CN)
GUO ERIC (CN)
International Classes:
C23C28/00
Domestic Patent References:
| WO2015199646A1 | 2015-12-30 | |||
| WO2012045713A1 | 2012-04-12 | |||
| WO2016122467A1 | 2016-08-04 |
Foreign References:
| CN110054956A | 2019-07-26 | |||
| GB2522626A | 2015-08-05 | |||
| US20100209732A1 | 2010-08-19 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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