Title:
COIL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/053442
Kind Code:
A1
Abstract:
This coil device comprises at least one printed wiring board. The at least one printed wiring board has a base film including first and second main surfaces, and a first conductive pattern formed of a first wiring part that is wound in a spiral form on the first main surface. The average distance between adjacent portions of the first wiring part is 3-15 μｍ. The length of the first wiring part is 150-1000 mm.
Inventors:
KAWAGUCHI MASAFUMI (JP)
SAKAI SHOICHIRO (JP)
NOGUCHI KOU (JP)
SAKAI SHOICHIRO (JP)
NOGUCHI KOU (JP)
Application Number:
PCT/JP2021/036417
Publication Date:
April 06, 2023
Filing Date:
October 01, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01F17/04; H01F17/00
Domestic Patent References:
| WO2016147993A1 | 2016-09-22 | |||
| WO2010007858A1 | 2010-01-21 |
Foreign References:
| JP2021013004A | 2021-02-04 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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