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Patent Searching and Data


Title:
COMMUNICATION METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/130989
Kind Code:
A1
Abstract:
The present application provides a communication method and apparatus. The method comprises: a first IAB node may perform a header rewriting operation on a data packet of a second IAB node from a heterogeneous topology, the header rewriting operation specifically being to modify a first routing identifier in the data packet into a second routing identifier; and before the header rewriting operation, the first IAB node modifies a third routing identifier in the data packet into the first routing identifier. A BAP address in the first routing identifier is allocated to a first host node, and a BAP address in the second routing identifier and a BAP address in the third routing identifier are allocated to a second host node. In a hybrid topology routing scenario, the present method may flexibly realize header rewriting of data packets of heterogeneous topologies, so that transmission failure caused by address conflicts among the nodes in scenarios such as hybrid topology routing is reduced, and transmission reliability can be improved.

Inventors:
LI KUIKUI (CN)
SUN FEI (CN)
SHI YULONG (CN)
ZENG QINGHAI (CN)
Application Number:
PCT/CN2022/141562
Publication Date:
July 13, 2023
Filing Date:
December 23, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04L41/12
Foreign References:
CN113748712A2021-12-03
Other References:
FUTUREWEI: "RAN2 impacts of Rel.17 IAB topology adaptation enhancements", 3GPP TSG-RAN WG2 MEETING #113 ELECTRONIC BIS R2-2105454, 11 May 2021 (2021-05-11), XP052007052
QUALCOMM INCORPORATED: "Backhaul transport for inter-donor redundancy", 3GPP TSG-RAN WG3 MEETING #112-E R3-211741, 6 May 2021 (2021-05-06), XP052001442
HUAWEI, HISILICON: "Inter-donor routing, local rerouting and RLF indication for R17-IAB", 3GPP TSG-RAN WG2 MEETING #115-E R2-2107253, 6 August 2021 (2021-08-06), XP052033992
QUALCOMM: "Running CR to 38.300 for eIAB", 3GPP TSG-RAN WG2 MEETING #115 R2- 2111450, 19 November 2021 (2021-11-19), XP052078431
SAMSUNG: "Discussion on the inter-CU routing", 3GPP TSG-RAN WG2 #116-E R2-2109775, 22 October 2021 (2021-10-22), XP052066253
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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