Title:
COMPOISTE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/030197
Kind Code:
A1
Abstract:
This composite material is provided with a plurality of first layers and a plurality of second layers. The total number of the first layers and the second layers is 5 or more. The first layers and the second layers are alternately stacked in the thickness direction of the composite material in such a manner that the first layers are positioned in a first surface and in a second surface. The first layers are formed of a metal material that is mainly composed of copper. The second layers comprise a molybdenum plate and a copper filler. The molybdenum plate has a first face and a second face, which are end faces in the thickness direction, and a plurality of openings that penetrate through the molybdenum plate from the first face to the second face. The copper filler is arranged within the openings. The thickness of the first layer that is positioned in the first surface is not less than 0.025 mm but not more than 30% of the thickness of the composite material. The thickness of the second layer that is in contact with the first layer positioned in the first surface is not less than 0.05 mm but not more than 35% of the thickness of the composite material.
Inventors:
MAEDA TORU (JP)
MIYANAGA MIKI (JP)
KONDO DAISUKE (JP)
ITO MASAYUKI (JP)
YAMAGATA SHIN-ICHI (JP)
MIYANAGA MIKI (JP)
KONDO DAISUKE (JP)
ITO MASAYUKI (JP)
YAMAGATA SHIN-ICHI (JP)
Application Number:
PCT/JP2021/026256
Publication Date:
February 10, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)
ALMT CORP (JP)
International Classes:
H01L23/36; B32B3/24; B32B15/01; H05K7/20
Domestic Patent References:
| WO2019208577A1 | 2019-10-31 |
Foreign References:
| JP2018182088A | 2018-11-15 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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