Title:
METHOD FOR DIVIDING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/030198
Kind Code:
A1
Abstract:
The present invention provides a method for dividing a bonded body, said method enabling separation of an adhesive in a bonded body for display devices even in cases where the adhesive is firmly adhered to a member. The present invention provides a method for dividing a bonded body for display devices. With respect to this method, the bonded body comprises two members which are bonded to each other by means of an adhesive that contains a water affinity agent. In addition, this method comprises a step wherein the adhesive is separated from the members by supplying steam to the adhesive.
Inventors:
KOSAKA NAOFUMI (JP)
SHIMIZU YOSUKE (JP)
KUMAKURA KENTA (JP)
SHIMIZU YOSUKE (JP)
KUMAKURA KENTA (JP)
Application Number:
PCT/JP2021/026290
Publication Date:
February 10, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/00; C09J11/00; C09J201/00
Domestic Patent References:
| WO2019151194A1 | 2019-08-08 |
Foreign References:
| JP2011084733A | 2011-04-28 | |||
| JP2009242792A | 2009-10-22 | |||
| JP2014008450A | 2014-01-20 | |||
| JP2017077947A | 2017-04-27 | |||
| JP2005247980A | 2005-09-15 | |||
| JP2009199069A | 2009-09-03 | |||
| JP2004083177A | 2004-03-18 | |||
| JP2019135180A | 2019-08-15 |
Attorney, Agent or Firm:
OI, Michiko (JP)
Download PDF:
Previous Patent: COMPOISTE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
Next Patent: DISPLAY DEVICE
Next Patent: DISPLAY DEVICE