Title:
COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/065037
Kind Code:
A1
Abstract:
[Problem] To provide: a component-equipped body that can prevent degradation of quality caused by deformation of a circuit board; and an electronic apparatus that comprises the component-equipped body. [Solution] The component-equipped body according to one embodiment of the present invention has a component mounting substrate, a connector component, and a heat sink. The component mounting substrate has a first surface and a second surface that is on the reverse side from the first surface. The connector component is provided upon the first surface. The heat sink faces the second surface and has a first pedestal part that contacts the second surface in an area that faces the connector component with the component mounting substrate therebetween.
Inventors:
EGUCHI YUU (JP)
Application Number:
PCT/JP2018/031563
Publication Date:
April 04, 2019
Filing Date:
August 27, 2018
Export Citation:
Assignee:
KYB CORP (JP)
International Classes:
H01L23/40; H01L23/36; H02K11/30; H05K7/06; H05K7/20
Foreign References:
| JP2016116274A | 2016-06-23 | |||
| JP2009194254A | 2009-08-27 | |||
| JP2016036243A | 2016-03-17 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
Download PDF:
Previous Patent: COMPONENT-EQUIPPED BODY AND ELECTRONIC APPARATUS
Next Patent: COMPOSITION TO IMPROVE MICROBIOME
Next Patent: COMPOSITION TO IMPROVE MICROBIOME