Title:
COMPONENT MOUNTING DEVICE AND MANUFACTURING METHOD FOR MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/084831
Kind Code:
A1
Abstract:
This component mounting device mounts an electronic component having a functional unit onto a substrate. The component mounting device has a component supply mechanism, a recognition unit, a component mounting mechanism, and a hold position determination unit. The component supply mechanism supplies an electronic component. The recognition unit recognizes the position of the functional unit. The component mounting mechanism retains the electronic component supplied from the component supply mechanism and mounts the electronic component onto the substrate. On the basis of the position of the functional unit recognized by the recognition unit, the hold position determination unit determines the position at which the electronic component will be held by the component mounting mechanism.
Inventors:
KATOU HIDEAKI
AZUMA NAOKI
SAKURAI KOJI
IKEDA MASANORI
AZUMA NAOKI
SAKURAI KOJI
IKEDA MASANORI
Application Number:
PCT/JP2020/029755
Publication Date:
May 06, 2021
Filing Date:
August 04, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K13/04
Foreign References:
| JP2017139388A | 2017-08-10 | |||
| JP2016157898A | 2016-09-01 | |||
| JP2016157899A | 2016-09-01 | |||
| JP2015119134A | 2015-06-25 |
Other References:
See also references of EP 4054301A1
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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