Title:
COMPONENT MOUNTING DEVICE AND THREE-DIMENSIONAL MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2022/107317
Kind Code:
A1
Abstract:
A component mounting device according to the present invention can comprise, on a portion of a component supply device for supplying a component to be mounted on a substrate, a holding member loading unit for loading a holding member capable of holding the component.
Inventors:
TAKAYANAGI MASAKAZU (JP)
Application Number:
PCT/JP2020/043411
Publication Date:
May 27, 2022
Filing Date:
November 20, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2015037099A1 | 2015-03-19 |
Foreign References:
| JP2014236010A | 2014-12-15 | |||
| JP3466153B2 | 2003-11-10 | |||
| JP4933351B2 | 2012-05-16 | |||
| JPH11340692A | 1999-12-10 |
Attorney, Agent or Firm:
KYORITSU INTERNATIONAL (JP)
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