Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/056785
Kind Code:
A1
Abstract:
Prior art discloses the feature of measuring the height of the entire substrate for each substrate prior to a production operation for mounting a component on a substrate (component mounting). However, time for inspection was necessary besides production time because each substrate was subjected to inspection, thereby causing productivity to decrease. The present invention has a component mounting unit containing a nozzle and a distance detection unit for optically obtaining the distance between a substrate and a component held by the aforementioned nozzle, and is characterized in that an illumination region formed by the distance detection unit is formed in the vicinity of a section in which the nozzle is projected onto the substrate.
Inventors:
TAKAHIRA ISAO (JP)
INOUE TOMOHIRO (JP)
IKEDA HIROSHI (JP)
ASAI JUN (JP)
INOUE TOMOHIRO (JP)
IKEDA HIROSHI (JP)
ASAI JUN (JP)
Application Number:
PCT/JP2014/077709
Publication Date:
April 23, 2015
Filing Date:
October 17, 2014
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2007063763A1 | 2007-06-07 |
Foreign References:
| JP2006019469A | 2006-01-19 | |||
| JP2004071641A | 2004-03-04 | |||
| JP2013045785A | 2013-03-04 |
Other References:
See also references of EP 3035783A4
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P. C. (JP)
Patent business corporation Isono international patent trademark office (JP)
Patent business corporation Isono international patent trademark office (JP)
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