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Patent Searching and Data


Title:
COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2021/130975
Kind Code:
A1
Abstract:
A transfer material supply unit (13,14) for supplying a transfer material to a transfer table (80) and spreading the transfer material in the form of a film on the transfer table is set in a vacant space of a feeder set unit (12) of a component mounting machine (10). A transfer pin (24, 25) for transferring the transfer material on the transfer table onto a mounting surface (15a) of a three-dimensional substrate (15) is retained so as to be replaceable with a suction nozzle (23) for suctioning a circuit component with respect to at least one mounting head of the mounting machine. The mounting head retaining the transfer pin is moved over the transfer table where the transfer pin is moved down and up to dip the lower end of the transfer pin in the transfer material on the transfer table. After the transfer material is attached to the lower end of the transfer pin, the mounting head is moved over the mounting surface of the three-dimensional substrate where the transfer pin is moved down and up to transfer the transfer material attached to the lower end of the transfer pin onto the mounting surface of the three-dimensional substrate.

Inventors:
ICHINO SHINJI (JP)
IWAKI NORIAKI (JP)
HAMANE TSUYOSHI (JP)
Application Number:
PCT/JP2019/051197
Publication Date:
July 01, 2021
Filing Date:
December 26, 2019
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H01L21/52; H05K13/04
Domestic Patent References:
WO2018163323A12018-09-13
WO2017141306A12017-08-24
WO2018055669A12018-03-29
WO2018163323A12018-09-13
Foreign References:
JP2017019059A2017-01-26
JP2002185117A2002-06-28
Other References:
See also references of EP 4084046A4
Attorney, Agent or Firm:
KAKO, Muneo (JP)
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