COMPONENT MOUNTING MACHINE

Title:

COMPONENT MOUNTING MACHINE

Document Type and Number:

WIPO Patent Application WO/2018/163388

Kind Code:

A1

Abstract:

This component mounting machine is provided with a control device for controlling a wafer supply device and a component transfer device. The control device is provided with: a die information storage unit in which the position of each die contained in the wafer supply device is stored in association with a rank allocated to each die; a block information acquisition unit which acquires a condition of a die to be mounted on a block provided on a substrate; a rank designation unit which, on the basis of content stored in the block information acquisition unit, designates, with respect to the component transfer device, the rank of a die to be picked up; and a position designation unit which, on the basis of the designation by the rank designation unit and content stored in the die information storage unit, performs position designation, with respect to the component transfer device, of the die to be picked up. The position designation unit performs the position designation of the die in such a way that the dies having the rank designated by the rank designation unit are successively picked up for a plurality of wafers contained in the wafer supply device.

Inventors:

NAKAYAMA YUKINORI (JP)
FUJII SHINICHI (JP)

Application Number:

PCT/JP2017/009616

Publication Date:

September 13, 2018

Filing Date:

March 09, 2017

Export Citation:

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Assignee:

FUJI CORP (JP)

International Classes:

H01L21/67; H01L21/52

Domestic Patent References:

WO2013108368A1	2013-07-25
WO2013161173A1	2013-10-31
WO2016084407A1	2016-06-02

Foreign References:

JP5614825B1	2014-10-29
JPH03161942A	1991-07-11

Other References: