Title:
WAFER FEED DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/163389
Kind Code:
A1
Abstract:
A wafer feed device for feeding a wafer divided into a plurality of dies to a feed position, the wafer feed device being provided with: a die information storage unit for storing the number of dies for each rank allocated to each of the dies; a block information acquisition unit for acquiring the requirement condition regarding a die to be mounted on a block provided to a transported substrate; a block requirement number acquisition unit for acquiring the required number of dies to be mounted on the block; and a producible number calculation unit for calculating the number of producible blocks on the basis of the content stored in the die information storage unit and the content acquired by the block information acquisition unit and the block requirement number acquisition unit.
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Inventors:
FUJII SHINICHI (JP)
NAKAYAMA YUKINORI (JP)
NAKAYAMA YUKINORI (JP)
Application Number:
PCT/JP2017/009617
Publication Date:
September 13, 2018
Filing Date:
March 09, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H01L21/67; H01L21/52
Domestic Patent References:
| WO2013161173A1 | 2013-10-31 | |||
| WO2016084407A1 | 2016-06-02 |
Foreign References:
| JP5614825B1 | 2014-10-29 | |||
| JPH08264998A | 1996-10-11 | |||
| JPH03161942A | 1991-07-11 |
Other References:
See also references of EP 3594995A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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