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Title:
COMPONENT MOUNTING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/161458
Kind Code:
A1
Abstract:
In this component mounting program for mounting a component on a substrate, it is possible to identify whether a component fed from a tape feeder on the component mounting program is a component fed from a sequential taped component or a component fed from a taped component other than the sequential taped component.

Inventors:
KITAGAWA MASAHIRO (JP)
Application Number:
PCT/JP2020/005591
Publication Date:
August 19, 2021
Filing Date:
February 13, 2020
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/00; H05K13/02
Domestic Patent References:
WO2018087848A12018-05-17
Foreign References:
JP2002271092A2002-09-20
JPS59158598A1984-09-08
JPH1117390A1999-01-22
US3594889A1971-07-27
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
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