COMPONENT MOUNTING SYSTEM, COMPONENT FEEDER, AND COMPONENT MOUNTING METHOD

Title:

COMPONENT MOUNTING SYSTEM, COMPONENT FEEDER, AND COMPONENT MOUNTING METHOD

Document Type and Number:

WIPO Patent Application WO/2021/100185

Kind Code:

A1

Abstract:

A chip mounting system (1) comprises: a chip feeding part (11) that feeds chips (CP); a head (33H) on a distal end of which is provided a chip-supporting part (432a); a first chip-conveying part (51) that conveys a chip (CP) held by a first chip-holding part (512) to a transfer position (Pos1); and a supporting-part-driving part (432b) that, with the first chip-holding part (512) that holds the chip (CP) being positioned at the transfer position (Pos1) and the center of the chip (CP) being supported by the chip-supporting part (432a), moves the chip-supporting part (432a) to vertically above the first chip-holding part (512) to transfer the chip (CP) from the first chip-holding part (512) to the head (33H).

Inventors:

YAMAUCHI AKIRA (JP)

Application Number:

PCT/JP2019/045704

Publication Date:

May 27, 2021

Filing Date:

November 21, 2019

Export Citation:

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Assignee:

BONDTECH CO LTD (JP)

International Classes:

H01L21/52; H01L21/60; H01L21/67; H05K13/00; H05K13/04

Domestic Patent References:

WO2018147147A1

2018-08-16

Foreign References:

JPS63228638A	1988-09-22
JP2013239747A	2013-11-28
JP2010192648A	2010-09-02
JP2019140232A	2019-08-22
JP2008210922A	2008-09-11
JPH01179340A	1989-07-17
JP2014027246A	2014-02-06
JP2014187303A	2014-10-02
JP2012238775A	2012-12-06
JP2003523627A	2003-08-05

Other References: