Title:
COMPONENT SUB-ASSEMBLY DEVICE AND SIDE RING ATTACHMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/142512
Kind Code:
A1
Abstract:
A device for attaching another component to a first component, which is a sub-assembly object, and forming a sub-assembly component. A first component loading unit 10, a component attachment unit 20 for attaching another component to a first component loaded by the loading unit 10 and forming a sub-assembly component, an inspection unit 30 for inspecting the quality of the sub-assembly component formed by the component attachment unit 20 and determining whether the sub-assembly component is good or bad, a delivery unit 40 for delivering good articles and defective articles to different respective places on the basis of the determination result from the inspection unit 30, and a control unit 50 for controlling the operation of the aforementioned units are mounted together on a frame 60 provided with casters 70. The present invention can thereby easily moved in response to a change in the layout of a factory.
Inventors:
TATEYAMA KENSHI (JP)
TATSUMI RYUICHI (JP)
TATSUMI RYUICHI (JP)
Application Number:
PCT/JP2017/003632
Publication Date:
August 09, 2018
Filing Date:
February 01, 2017
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B23P19/02; B23P21/00
Foreign References:
| JPH06277957A | 1994-10-04 | |||
| JP4341493B2 | 2009-10-07 | |||
| JP3328499B2 | 2002-09-24 | |||
| JPH0976129A | 1997-03-25 |
Attorney, Agent or Firm:
Sado Noboru (JP)
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