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Patent Searching and Data


Title:
COMPOSITE COPPER PARTICLES, METHOD FOR PRODUCING SAME, AND METHOD FOR MOLDING COMPOSITE COPPER MOLDED BODY PERFORMED USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/126998
Kind Code:
A1
Abstract:
Provided are composite copper particles which can be molded practically into a copper molded body by a 3D printer. These composite copper particles are obtained by dispersing particles, which comprise a light-absorbing substance having a light absorption rate of light having a wavelength of 1μm of 40% or higher and have a smaller particle diameter than do copper base particles, among said copper base particles. The light absorption rate of the composite copper particles is comparatively high, and consequently, it is possible to mold a copper molded body at a low power output, even using a 3D printer which uses a Yb fiber laser, for example. These composite copper particles can be produced by preparing precursor particles in which small copper particles which have a smaller particle diameter than do the base particles and particles of the light-absorbing substance are aggregated with one another, the precursor particles are inserted into a thermal plasma frame, the base particles are generated by melting the small copper particles, and said composite copper particles are spheroidized.

Inventors:
NIIMI YOSHIO (JP)
INOUE YOSHIAKI (JP)
Application Number:
PCT/JP2021/048491
Publication Date:
July 06, 2023
Filing Date:
December 27, 2021
Export Citation:
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Assignee:
NIIMI SANGYO CO LTD (JP)
International Classes:
B22F9/02; B22F1/00; B22F1/12; B22F1/14; B22F9/04; B22F10/28; B33Y70/10
Foreign References:
JP2018188689A2018-11-29
JP2007211332A2007-08-23
JP2022021968A2022-02-03
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
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