Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE SHEET, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/126997
Kind Code:
A1
Abstract:
[Problem] To provide a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer which, even when adopted in communication devices for conducting high-speed communication, is less apt to reduce the communication speed. [Solution] A pressure-sensitive adhesive composition comprising a block copolymer (I) including a polymer block (A) consisting mainly of monomer units derived from an aromatic vinyl compound and a tackifier (II), and giving a pressure-sensitive adhesive layer having a dielectric loss tangent, as determined at a frequency of 5 GHz, of less than 0.0005. A pressure-sensitive adhesive layer 11 obtained by applying this pressure-sensitive adhesive composition to a release film 12 has an extremely low dielectric loss tangent and, hence, even when adopted in communication devices for conducting high-speed communication, enables the communication devices to have a reduced transmission loss and to be less apt to decrease in communication speed. This pressure-sensitive adhesive layer 11 can be provided, for example, as a pressure-sensitive adhesive sheet including same and as a laminate including same.
Inventors:
KANAZUKA YOHEI (JP)
Application Number:
PCT/JP2021/048490
Publication Date:
July 06, 2023
Filing Date:
December 27, 2021
Export Citation:
Assignee:
APM JAPAN INC (JP)
International Classes:
C09J11/08; C09J7/38; C09J153/02
Domestic Patent References:
| WO2021024303A1 | 2021-02-11 |
Foreign References:
| JP2017057382A | 2017-03-23 | |||
| JP2017149938A | 2017-08-31 | |||
| JP2016065121A | 2016-04-28 | |||
| JP6985553B1 | 2021-12-22 |
Attorney, Agent or Firm:
KUROSUMI Tomohiko et al. (JP)
Download PDF: