Title:
COMPOSITE FILM, PACKAGING BAG, LID MEMBER, CONTAINER WITH LID, AND MANUFACTURING METHOD OF COMPOSITE FILM
Document Type and Number:
WIPO Patent Application WO/2022/230588
Kind Code:
A1
Abstract:
An adhesive composition of a specific configuration is applied as a heat-softening adhesive resin layer of the composite film, which is a packaging material. Specifically, the composite film 10 is formed by laminating at least a substrate layer 1, a heat-softening adhesive resin layer 2 and a heat seal layer 3, in that order, and the heat-softening adhesive resin layer 2 is configured from a heat-softening adhesive resin that forms a crosslinked structure.
Inventors:
YOSHIMURA SEIGO (JP)
SHIBATA NAOAKI (JP)
ONO SHIORI (JP)
SHIBATA NAOAKI (JP)
ONO SHIORI (JP)
Application Number:
PCT/JP2022/016174
Publication Date:
November 03, 2022
Filing Date:
March 30, 2022
Export Citation:
Assignee:
KYODO PRINTING CO LTD (JP)
International Classes:
B32B27/00; B32B27/08; B32B27/26; B65D65/40; B65D81/34
Domestic Patent References:
| WO2021024981A1 | 2021-02-11 |
Foreign References:
| JP2012240734A | 2012-12-10 | |||
| JP2017124859A | 2017-07-20 | |||
| JP2019034753A | 2019-03-07 | |||
| JP2022024359A | 2022-02-09 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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