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Title:
COMPOSITE HARD-SURFACE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/084132
Kind Code:
A1
Abstract:
A composite hard-surface material preparation method and a composite hard-surface material prepared thereby, the preparation method comprising: dispersedly fixing a plurality of cemented carbide sheets (2) to a surface of a metal substrate (1); and surfacing the cemented carbide sheets (2) and the metal substrate (1) with a solder (3) to obtain a composite hard-surface material, the solder (3) comprising nickel-based alloy powder, tungsten carbide particles and boron nitride powder. The solder (3) used in the preparation of the composite hard-surface material comprises nickel-based alloy powder, tungsten carbide particles and boron nitride powder, wherein the nickel-based alloy powder can increase fluidity and corrosion resistance, the tungsten carbide particle can improve hardness, and the boron nitride powder can effectively reduce friction coefficient. The present solder has good fluidity, high hardness and good solderability, using said solder, the obtained composite hard-surface material may enjoy good wear resistance.

Inventors:
CHEN CANKUN (CN)
XU YUEHUA (CN)
CAO ZHIHUA (CN)
Application Number:
PCT/CN2015/097092
Publication Date:
May 26, 2017
Filing Date:
December 11, 2015
Export Citation:
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Assignee:
SEED TECH CORP LTD (CN)
International Classes:
B23K10/02; B23K35/30; B23K103/18
Domestic Patent References:
WO2014091290A12014-06-19
Foreign References:
CN104976200A2015-10-14
CN1433868A2003-08-06
CN104976201A2015-10-14
CN101148008A2008-03-26
CN103388145A2013-11-13
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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