Title:
COMPOSITE HEAT DISSIPATION STRUCTURE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221045
Kind Code:
A1
Abstract:
The present disclosure provides a composite heat dissipation structure and a display device. The composite heat dissipation structure comprises: a grid tape, a buffer layer and a ferrite layer stacked in sequence, and a flexible circuit board provided on the side of the ferrite layer facing the grid tape. The flexible circuit board comprises a substrate and a conductive layer located on at least one side of the substrate, the conductive layer is provided with a heat dissipation pattern and a communication antenna pattern, and an orthographic projection of the heat dissipation pattern on the substrate does not overlap with an orthographic projection of the communication antenna pattern on the substrate.
Inventors:
WANG WEI (CN)
Application Number:
PCT/CN2022/093903
Publication Date:
November 23, 2023
Filing Date:
May 19, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H01Q1/02; H05K7/20
Foreign References:
| CN107735902A | 2018-02-23 | |||
| CN109633983A | 2019-04-16 | |||
| CN113922057A | 2022-01-11 | |||
| CN105051840A | 2015-11-11 | |||
| JP2004349400A | 2004-12-09 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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