Title:
WIRING SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/221046
Kind Code:
A1
Abstract:
The present disclosure provides a wiring substrate and an electronic device. The wiring substrate comprises: a substrate; a first pad group, which is located on the substrate and comprises a power supply pad and an output pad; a power signal line, which is located on the same side of the substrate with the first pad group and is coupled with the power supply pad; a second pad group, which is located on the same side of the substrate with the first pad group and comprises multiple sub-pad groups that are electrically connected to each other, each sub-pad group at least comprising a first sub-pad and a second sub-pad, a first sub-pad in at least one sub-pad group among the multiple sub-pad groups being coupled with the power signal line, and a second sub-pad in at least one sub-pad group among the multiple sub-pad groups being coupled with the output pad of the first pad group.
Inventors:
WU XINTAO (CN)
XU ZOUMING (CN)
WANG JIE (CN)
XU JIAWEI (CN)
LUO NINGYU (CN)
HAN TINGWEI (CN)
LI YUAN (CN)
XU ZOUMING (CN)
WANG JIE (CN)
XU JIAWEI (CN)
LUO NINGYU (CN)
HAN TINGWEI (CN)
LI YUAN (CN)
Application Number:
PCT/CN2022/093904
Publication Date:
November 23, 2023
Filing Date:
May 19, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI BOE RUISHENG TECH CO LTD (CN)
HEFEI BOE RUISHENG TECH CO LTD (CN)
International Classes:
H01L33/62
Foreign References:
| CN113745393A | 2021-12-03 | |||
| CN109390304A | 2019-02-26 | |||
| CN114488607A | 2022-05-13 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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