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Patent Searching and Data


Title:
COMPOSITE-MATERIAL MOLDING APPARATUS AND COMPOSITE-MATERIAL MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/134988
Kind Code:
A1
Abstract:
A composite-material molding apparatus 1 for molding a composite material, wherein the molding apparatus 1 is provided with: a main body 11; a composite-material layer 12 in which a molding face 12a for molding a composite material is formed, the composite-material layer 12 coating the surface of the main body 11; a filamentous fiber-optic temperature sensor 14 embedded in the composite-material layer 12; a heating unit 13 provided inside the main body 11; and a control device 15 for controlling the heating unit 13 on the basis of the temperature measured by the fiber-optic temperature sensor 14; the fiber-optic temperature sensor 14 being disposed in planar fashion in a plane parallel to the molding face 12a.

Inventors:
SHIMIZU TAKAYUKI (JP)
ABE TOSHIO (JP)
Application Number:
PCT/JP2017/000550
Publication Date:
August 10, 2017
Filing Date:
January 11, 2017
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
G01K11/32; B29C70/06
Foreign References:
JP2012131080A2012-07-12
JP2008185456A2008-08-14
JP2000501176A2000-02-02
Other References:
See also references of EP 3412435A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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