COMPOSITE RELEASE LAYER FOR CARRIER-ATTACHED METAL FOIL AND METAL FOIL COMPRISING SAME

WIPO Patent Application WO/2023/219190

A1

The present invention relates to a composite release layer for a carrier-attached metal foil and a metal foil comprising same. The present invention provides a composite release layer for a carrier-attached metal foil, the release layer enabling the smooth removal of a carrier from the carrier-attached metal foil, wherein the release layer comprises: a metal-containing release layer formed on the carrier; and an organic and inorganic release layer formed on the metal-containing release layer, the organic and inorganic release layer containing: a heterocyclic compound containing nitrogen; an amine-based compound; and a transition metal compound of groups 3 to 8 of the periodic table.

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CHUN SUNG WOOK (KR)
CHUNG BO MOOK (KR)
KIM DAE GEUN (KR)
YANG DONGMIN (KR)
KANG JIN SEOK (KR)
PARK MIN YEONG (KR)

PCT/KR2022/006849

November 16, 2023

May 13, 2022

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YMT CO LTD (KR)

H05K3/02; B32B7/06; C23C22/60; C23C28/00; C25D3/38; C25D3/56; H05K3/38

KR20160111985A	2016-09-27
JP2021035755A	2021-03-04
JP2001215736A	2001-08-10
KR20180090207A	2018-08-10
KR101460553B1	2014-11-12

KWAK, Hyun Kyu (KR)

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