Title:
COMPOSITE RESIN COMPOSITION, AND ELECTRONIC COMPONENT FORMED FROM SAID COMPOSITE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/074155
Kind Code:
A1
Abstract:
Provided are: a composite resin composition from which electronic components can be obtained, the composite resin composition having excellent heat resistance and in which warping deformation and blistering are suppressed; and an electronic component formed from the composite resin composition. A composite resin composition according to the present invention includes (A) a liquid crystal polymer, (B) a fibrous filling agent, and (C) a plate-shaped filling agent. The (A) liquid crystal polymer comprises, as necessary constituent components, structure units (I) to (V) in prescribed amounts, and is a fully aromatic polyester amide that exhibits optical anisotropy during melting, and the weight-average fiber length of the (B) fibrous filling agent is 250 μm or more.
Inventors:
FUKATSU HIROKI (JP)
TAKI TOMOHIRO (JP)
TAKI TOMOHIRO (JP)
Application Number:
PCT/JP2017/034662
Publication Date:
April 26, 2018
Filing Date:
September 26, 2017
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L77/12; C08G69/44; C08K7/00; H01R12/72; H01R13/46
Domestic Patent References:
| WO2017068869A1 | 2017-04-27 | |||
| WO2016088714A1 | 2016-06-09 | |||
| WO1998056578A1 | 1998-12-17 | |||
| WO2014050371A1 | 2014-04-03 | |||
| WO2013115168A1 | 2013-08-08 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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