Title:
COMPOSITE SUBSTRATE AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2016/021561
Kind Code:
A1
Abstract:
Provided are a composite substrate with which it is possible to balance reduction in thermal resistance and suppression of thermal stress, and a power module. The substrate 10 is provided with: an insulating base material 11 configured as a flat plate and used in a power module 1 that is provided with a semiconductor chip 16, the substrate 10, on which the semiconductor chip 16 is mounted, and a cooler 18 for dissipating the heat generated from the semiconductor chip 16; a circuit layer 12 provided on one surface of the insulating base material 11 and having a circuit pattern formed thereon; a metal layer 13 provided on the other surface of the insulating base material 11; and a buffer layer 14 formed on the surface of the metal layer 13 using a composite material containing copper and an additive material comprising any of a nickel-iron alloy, titanium, chromium, tungsten, and molybdenum, the buffer layer being bonded to the cooler 18.
Inventors:
ITOH HIDEMASA (JP)
YAMAUCHI YUICHIRO (JP)
YAMAUCHI YUICHIRO (JP)
Application Number:
PCT/JP2015/071992
Publication Date:
February 11, 2016
Filing Date:
August 03, 2015
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H01L23/36; H01L23/12; H01L23/13; H05K1/02; H05K7/20
Domestic Patent References:
| WO2013047330A1 | 2013-04-04 |
Foreign References:
| JP4645464B2 | 2011-03-09 | |||
| JP2012160642A | 2012-08-23 | |||
| JP2013016525A | 2013-01-24 | |||
| JP2008300455A | 2008-12-11 |
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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