Title:
COMPOSITION CONTAINING HIGHLY SAFE AMIDE COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/171679
Kind Code:
A1
Abstract:
[Problem] To provide a composition that has high dissolving power for water and various organic and inorganic materials, is free of harmfulness such as irritation and toxicity, and can be used easily for various industrial purposes, such as such as a solvent for chemical reactions and resin synthesis, a solvent for analysis, a solvent for dissolution of resins, coatings, inks, etc., a diluent for dilution, a dispersant for dispersion, etc., a cleaning agent for cleaning production equipment, metal parts, electronic components, etc., a stripping agent for stripping resists and resins, a liquid crystal aligning agent for aligning liquid crystal molecules, a nonaqueous electrolyte for battery production, etc., and to provide various preparations and products that contain the composition. [Solution] A composition containing a compound (A) having an N-substituted and/N,N-disubstituted amide group and a neutralized salt (B) of an acidic compound and a basic compound.
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Inventors:
HIRATA MEIRI (JP)
KIYOSADA TOSHITSUGU (JP)
MASUDA HIDEKI (JP)
KIYOSADA TOSHITSUGU (JP)
MASUDA HIDEKI (JP)
Application Number:
PCT/JP2023/008624
Publication Date:
September 14, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
KJ CHEMICALS CORP (JP)
International Classes:
C08L101/00; C08K5/17; C08K5/20; C11D7/32; C11D7/50; G02F1/1337; H01M4/62; H01M10/052; H01M10/0569
Foreign References:
| JP2021065882A | 2021-04-30 | |||
| JP2015140341A | 2015-08-03 |
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