COMPOSITION, EPOXY RESIN-CURING AGENT, EPOXY RESIN COMPOSITION, THERMOSETTING COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND INTERLAYER INSULATING MATERIAL

WIPO Patent Application WO/2018/235751

A1

This composition contains a maleimide compound (A) represented by general formula (1), an aminophenol compound (B) represented by general formula (2), and a phenol compound (C) represented by general formula (3). The composition has superior storage stability and is suitable as a curing agent for an epoxy resin composition which can have high flame resistance, high heat resistance, and low decomposition characteristics at high temperature. (In formula (1), Ar1 represents an optionally substituted arylene group having 6-12 carbon atoms, X1 represents a direct bond, a divalent hydrocarbon group having 1-6 carbon atoms, O, S, or SO2, and p represents an integer of 0-2.) (In formula (2), Ar2 represents an arylene group that has 6-12 carbon atoms and 0-2 hydroxy groups, and that optionally has a hydrocarbon substituent, X2 represents a direct bond, a divalent hydrocarbon group having 1-6 carbon atoms, O, S, or SO2, and q represents an integer of 0-2.) (In formula (3), Ar3 represents an arylene group that has 6-24 carbon atoms, 0-2 hydroxy groups, and 2-4 allyl groups per molecule, X3 represents a direct bond, a divalent hydrocarbon group having 1-6 carbon atoms, O, S, or SO2, and r represents an integer of 0-2.)

TAKAHASHI KOU (JP)
MURATA KIYOTAKA (JP)

PCT/JP2018/023027

December 27, 2018

June 15, 2018

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AIR WATER INC (JP)

C08G59/40; H01L23/29; H01L23/31

JPH0359033A	1991-03-14
JPH04216818A	1992-08-06
JP2016204626A	2016-12-08
JP2015030733A	2015-02-16
JP2014196465A	2014-10-16
JP2016047811A	2016-04-07
JP2016514742A	2016-05-23
JP2000223805A	2000-08-11
JPH02132114A	1990-05-21
JPH02103213A	1990-04-16

OKUBO, Katsuyuki (JP)

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